I've used a lot of methods to work with surface mount components. I've carefully soldered and I've used the "slop and wick" method to mount tiny ICs to PCBs. I also invested in a hot air station (more on that one day) and I've seen people use toaster ovens for reflow.
Here's a new method I ran across on the Web today: http://www.reconnsworld.com/griddle_reflow.html shows using an electric gridle and easy to find paste to do surface mount. Interesting!
Labels: electronics, smd
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posted by Al @ 8:18 AM
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